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this is information on a product in full production. may 2014 docid022284 rev 3 1/15 ECMF06-6AM16 common mode filter with esd protection for mipi d-phy and mddi interface datasheet ? production data features ? very large differential bandwidth: higher than 6ghz ? high common mode attenuation: ? -24 db at 900 mhz ? -20 db between 800 mhz and 2.2 ghz ? very low pcb space consumption ? thin package: 0.55 mm max ? lead-free package ? high reduction of parasitic elements through integration complies with the following standards: ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications ? mobile phones ? notebook, laptop ? portable devices description the ECMF06-6AM16 is a highly integrated common mode filter designed to suppress emi/rfi common mode noise on high speed differential serial buses like mipi d-phy or mddi. the ECMF06-6AM16 can protect and filter 3 differential lanes. figure 1. pin configuration (top view) 1 micro qfn-16 l: 1.35 x 3.3 mm d0+ d0- gnd d1+ d1- d2+ d2- gnd d0+ d0- nc d1+ d1- d2+ d2 - gnd 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 www.st.com
characteristics ECMF06-6AM16 2/15 docid022284 rev 3 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 10 30 kv i dc maximum dc current 100 ma t op operating temperature -40 to +85 c t j maximum junction temperature 125 c t stg storage temperature range - 55 to +150 c symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = breakdown current br rm rm rm r i v i rm i r v rm v br table 2. electrical characteristics (values, t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 v i rm v rm = 3 v per line 100 na r dc dc serial resistance 2.7 4 ?
docid022284 rev 3 3/15 ECMF06-6AM16 characteristics 15 figure 3. sdd21 differential attenuation measurement (z 0 diff = 100 ? ) table 3. pin description pin name description pin name description pin name description pin name description 1 d0+ dsi receiver 5 d1- dsi receiver 9 d2- dsi transmitter 13 d1+ dsi transmitter 2 d0- dsi receiver 6 gnd dsi receiver 10 d2+ dsi transmitter 14 nc dsi transmitter 3 gnd dsi receiver 7 d2+ dsi receiver 11 gnd dsi transmitter 15 d0- dsi transmitter 4 d1+ dsi receiver 8 d2- dsi receiver 12 d1- dsi transmitter 16 d0+ dsi transmitter 100k 1m 10m 100m 1g -3 -2.5 -2 -1.5 -1 -0.5 0 sdd21 (db) f/hz d2 d0 d1
characteristics ECMF06-6AM16 4/15 docid022284 rev 3 figure 4. scc21 common mode attenuation measurement (z 0 com = 50 ? ) figure 5. sdd11 differential return loss measurement (z 0 diff = 100 ? ) 100k 1m 10m 100m 1g -40 -35 -30 -25 -20 -15 -10 -5 0 scc21 (db) f/hz d2 d0 d1 10m 30m 100m 300m 1g 3g -45 -40 -35 -30 -25 -20 -15 -10 -5 0 sdd11 (db) f/hz d0 d1 d2
docid022284 rev 3 5/15 ECMF06-6AM16 characteristics 15 figure 6. sdd22 differential attenuation measurement (z 0 diff = 100 ? ) figure 7. sddxx inter-lane differential cross-coupling measurement (z 0 diff = 100 ? ) 10m 30m 100m 300m 1g 3g -40 -35 -30 -25 -20 -15 -10 -5 0 sdd22 (db) f/hz d0 d1 d2 100k 1m 10m 100m 1g -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 sddxx (db) f/hz d0-d1 d0-d2
characteristics ECMF06-6AM16 6/15 docid022284 rev 3 figure 8. sccxx inter-lane common-mode cross-coupling measurement (z 0 diff = 100 ? ) figure 9. mipi d-phy low power mode test setup 100k 1m 10m 100m 1g -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 sccxx (db) f/hz d0-d1 d0-d2 generator agilent 81110 pattern mode, f = 10 mhz modulation rz, 50 output cmf oscilloscope lecroy 7300 1 a, m input
docid022284 rev 3 7/15 ECMF06-6AM16 characteristics 15 figure 10. low power pulse response - see figure 9 for test setup figure 11. esd response to iec61000-4-2 (+8 kv contact discharge) - see figure 13 for test set-up dx+ dx- 500 mv/div 1 ns/div 00 500 mv/div 1 ns/div 00 50 v/div 93 v 29 v 24 v 11 v 20 ns/div 1 2 4 v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 3 122 v 9v 9v 7v 1 2 4 3
characteristics ECMF06-6AM16 8/15 docid022284 rev 3 figure 12. esd response to iec61000-4-2 (-8 kv contact discharge) - see figure 13 for test set-up figure 13. esd measurement test set-up 50 v/div -76 v -23 v -6 v -4 v 20 ns/div 1 2 4 v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 3 -120 v -7 v -4 v -1 v 1 2 4 3 oscilloscope 50 input 2 x 20 db attenuator 2 x 20 db attenuator esd contact zap 8 kv on pins d0+ d0- gnd d1+ d1- d2+ d2- gnd d0+ d0- nc d1+ d1- d2+ d2 - gnd
docid022284 rev 3 9/15 ECMF06-6AM16 application information 15 2 application information figure 14. application information d0+ d0- gnd d1+ d1- clk+ clk- gnd d0+ d0- gnd d1+ d1- clk+ clk- gnd display application processor dsi receiver dsi transmitter
package information ECMF06-6AM16 10/15 docid022284 rev 3 3 package information ? epoxy meets ul94, v0 ? lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 15. micro qfn 3.3 x 1.35 16l package dimension definitions table 4. micro qfn 3.3 x 1.35 16l package dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 3.25 3.30 3.35 0.128 0.130 0.132 e 1.30 1.35 1.40 0.051 0.053 0.055 e 0.35 0.40 0.45 0.014 0.016 0.018 l 0.30 0.40 0.50 0.118 0.016 0.020 d index area (d/2 x e/2) top view side view bottom view e a e l b a1 index area (d/2 x e/2) pin # 1 id 1 8 9 16
docid022284 rev 3 11/15 ECMF06-6AM16 package information 15 figure 18. tape and reel specifications figure 16. footprint figure 17. marking 0.20 0.40 0.60 1.75 3.00 xx ww y p dot: pin 1 xx: marking ww: assembly week y: assembly year p: assembly plant dot identifying pin a1 location user direction of unreeling all dimensions in mm 4.00 0.1 2.00 0.1 12.00 0.3 3.70 0.1 4.00 0.1 1.75 0.1 5.5 0.1 ? 1.55 0.05 0.80 0.1 1.70 0.1 xx ww yp xx ww yp xx ww yp xx ww yp xx ww yp xx ww yp
recommendation on pcb assembly ECMF06-6AM16 12/15 docid022284 rev 3 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 19. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 20. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 180 m 540 m 200 m 600 m 10 m 30 m stencil window footprint 0.40 0.60 0.20 3.00 1.75
docid022284 rev 3 13/15 ECMF06-6AM16 recommendation on pcb assembly 15 4.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 4.5 reflow profile figure 21. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ordering information ECMF06-6AM16 14/15 docid022284 rev 3 5 ordering information figure 22. ordering information scheme for the latest information on available order codes see the product pages on www.st.com. 6 revision history table 5. ordering information order code marking package weight base qty delivery mode ECMF06-6AM16 kf micro qfn-16l 6.3 mg 3000 tape and reel ecmf 06 - 6 a m16 function common mode filter with esd protection number of filtered lines 06 = number of filtered lines number of esd protected lines 6 = 6 lines with esd protection version a = version package m = micro qfn, pitch 400 m 16 = 16 pads table 6. document revision history date revision changes 14-feb-2012 1 initial release. 04-oct-2012 2 inserted table 3 and updated figure 1 to add a1 marker. 26-may-2014 3 updated figure 21 , figure 22 , figure 22 and document reformatted.
docid022284 rev 3 15/15 ECMF06-6AM16 15 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

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